Integrated Photonics Process on SOI Wafers
This technology presents an advanced method for fabricating integrated photonic structures on silicon-on-insulator wafers, utilizing Germanium integration to enhance photodetector performance within photonic circuits.
Background:
With the growing demand for faster and more efficient optical communication systems, integrating photonic components directly...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake, Thomas Adam
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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