ROOM TEMPERATURE QUANTUM PROCESSOR BASED ON ON-CHIP ARRAYS OF SINGLE-ION QUDITS ENABLED BY MATERIALS SCIENCE AND ENGINEERING

Background:

Quantum sensing and quantum photonics represent rapidly advancing fields with the potential to revolutionize precision measurement, secure communication, and information processing. At the heart of these technologies are quantum devices that leverage the unique properties of quantum bits (qubits), such as superposition and entanglement, to achieve sensitivities and functionalities far beyond classical systems. There is a growing demand for quantum sensors that are not only highly sensitive and accurate but also practical for real-world deployment, particularly in sectors like aerospace, telecommunications, and defense. The ability to integrate quantum devices with photonic integrated circuits (PICs) and to fabricate them using scalable, foundry-compatible processes is essential for transitioning quantum technologies from laboratory demonstrations to widespread commercial and industrial use. Despite significant progress, current approaches to quantum sensing and photonic integration face substantial limitations. Most quantum devices require operation at extremely low temperatures—often below 3 K—and in high-vacuum environments, making them bulky, energy-intensive, and unsuitable for many practical applications, especially where size, weight, and power (SWaP) constraints are critical. Additionally, existing single-photon emitters (SPEs) at telecom wavelengths, which are vital for quantum networking and distributed sensing, are not robust or scalable enough for integration into large-scale systems. These challenges hinder the deployment of quantum sensors in real-world environments and limit their compatibility with standard semiconductor manufacturing processes, thereby restricting their potential impact across industries.

Technology Overview:

This technology is an on-chip quantum sensor platform that leverages arrays of individually addressable single-erbium ion qubits embedded within silicon-based hollow nanopillars. Utilizing advanced nanofabrication and materials engineering, the platform is fully compatible with standard semiconductor foundry processes, enabling scalable and cost-effective production. These quantum devices exhibit exceptional performance at room temperature, unattainable with current technologies. The quantum devices exhibit coherent operation in the telecom C-band with record-long optical quantum coherence exceeding 500 μs. Furthermore, another unique quantum functionality of the device is its ability to enable fast, high-contrast (>96%) coherent optical readout in the visible range (e.g., 518 nm) without an optical cavity. Together, these results establish a comprehensive telecom- and CMOS-compatible engineering strategy, enabled by materials science and engineering, that overcomes the ubiquitous challenge of maintaining quantum coherence under ambient conditions, enabling operation at temperatures more than 900-times higher than those required by current cryogenic quantum systems. Additionally, its design allows seamless integration with photonic integrated circuits (PICs). The platform is engineered to minimize size, weight, and power consumption, making it particularly well-suited for aerospace and other applications where these factors are critical. What differentiates this technology is its unique combination of scalability, operational practicality, and high performance. Unlike traditional quantum devices that require extreme cryogenic conditions and are often incompatible with large-scale manufacturing, this solution supports room-temperature operation and is fabricated using industry-standard processes. The use of single-erbium ion qubits in silicon-based hollow nanopillars not only enables telecom-wavelength operation—crucial for quantum networking and distributed sensing—but also achieves high readout fidelity and narrow optical linewidths. This makes the platform a plug-and-play solution for real-world deployment, overcoming longstanding barriers to the adoption of quantum sensors in demanding environments such as aerospace. Its compatibility with photonic integrated circuits further positions it as a foundational technology for the next generation of quantum communication and sensing networks. Furthermore, the devices pave the way for advanced telecom QIS technologies that could potentially extend the range of practical applications in quantum sensing and imaging for biomedical applications, and in quantum sensing and reference systems (clock synchronization, distributed computation) for a future Quantum Internet of Things.

Advantages:

•    Enables room temperature operation of quantum sensors, eliminating the need for extreme cryogenic cooling.
•    Compatible with foundry-based semiconductor fabrication processes for scalable, large-scale production.
•    Demonstrates record-long optical coherence times in the telecom C-band, exceeding 500 μs at ambient conditions, a performance previously limited to vacuum conditions at temperatures over 900 times lower.
•    Provides high readout contrast (>96%) and narrow single-ion optical linewidths (<90 MHz) in the telecom C-band for precise quantum sensing and communication.
•    Integrates seamlessly with photonic integrated circuits, facilitating compact and efficient quantum photonic devices.
•    Reduces size, weight, and power (SWaP) requirements, making it ideal for aerospace and other demanding applications.
•    Supports operation at ambient conditions (e.g., room temperature operation), enhancing practicality and robustness in real-world environments.
•    Offers plug-and-play, individually addressable quantum sensor arrays for versatile deployment in quantum networking and distributed sensing.

Applications:

•    Quantum networking for secure communications
•    Distributed quantum sensing arrays
•    Aerospace navigation and sensing systems
•    Photonic integrated circuit quantum sensors
•    Telecom-band quantum key distribution

Intellectual Property Summary:

Stage of Development:

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Licensing Status:

This technology is available for licensing.