This technology advances the fabrication and functionality of photonic integrated circuits by improving the deposition and manipulation of silicon carbon nitride and silicon nitride.
Photonics is the science of manipulating light to perform electronic and other functions while leveraging light’s advantages, including higher speed and parallel data transmission. Photonic integrated circuits (PICs) integrate optical components such as lasers, modulators, waveguides, and detectors on a single substrate. This offers a compact and efficient solution for managing optical signals. Materials commonly used in PICs include silicon (prevalent due to its mature fabrication techniques and compatibility with existing semiconductor processes) and silicon nitride or silicon-carbon nitride for specific optical properties such as low-light absorption in communication-specific wavelengths. Integrating various optical components on a single chip significantly enhances the chip’s performance, scalability, and the efficiency of optical systems.
This technology improves the fabrication and functionality of PICs by addressing the design and implementation of barrier materials in manufacturing these devices. Specifically, the technology improves the deposition and manipulation of silicon carbon nitride and silicon nitride over conductive formations within photonic structures. Barrier materials such as silicon carbon nitride and silicon nitride prevent unwanted interactions that can adversely affect the device’s reliability, and longevity, and overall performance. This technology optimizes the structural design and placement of barrier materials by selectively removing parts of the barrier layers to enhance light signal transmission. This approach is compatible with existing silicon-based PIC manufacturing processes, allowing for integration into current production lines without extensive modifications.
Photo for reference only, not a depiction of the invention.
• Improves deposition/manipulation of silicon carbon nitride and silicon nitride.
• Enhances PIC reliability and longevity.
• Increases light signal transmission.
• Can be integrated with existing PIC fabrication processes without extensive modification.
The primary application for this technology is the manufacture of photonic integrated circuits (PICs).
Patent Issued: US10,816,724 https://patents.google.com/patent/US11378739B2/en
TRL 6 - Technology demonstrated in relevant environment
This technology is available for licensing.
This technology would be of interest to anyone involved in the design, manufacture, and use of PICs, including:
• Semiconductor and electronics manufacturers
• Telecommunications
• High-performance computing
• Automotive
• Aerospace and defense
• Medical and healthcare