Improved Chemical-Mechanical Polishing Slurry Composition and Method to Improve Polishing of Metals and Non-metals Using Cerium Oxide Nanoparticles
Reducing manufacturing time, cost, and labor by employing chemistry to transform a two-step process into an easily controlled single-step.
Background: Integrated circuits are built of many layers. Each layer must be perfectly flat so that connections line up between layers and electricity flows properly throughout. Conventional CMP systems consist...
Published: 9/20/2024
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Inventor(s): Christopher Netzband, Kathleen Dunn
Keywords(s): abrasive, cerium, cerium oxide, chemical activity, chemical mechanical polishing, CMP, CMP slurries, dielectrics, fiber optics, integrated circuit, lens, mechanical polish, metallic surface, optics, polish, polishing, semiconductor wafers, semiconductors, slurry, surface finishing, surface quality
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology
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