Wafer Scale Bonded Active Photonics Interposer
This technology enables the creation of advanced photonic interposers by bonding photonics devices onto a wafer-scale base, improving integration and connectivity for optical and electronic components in microchips.
Background:
The field of integrated photonics has become increasingly important as demand for faster data transmission and higher bandwidth...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Douglas La Tulipe, Gerald Leake
Keywords(s):
Category(s): Technology Classifications > Nanotechnology, Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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Integrated Photonics Process on SOI Wafers
This technology presents an advanced method for fabricating integrated photonic structures on silicon-on-insulator wafers, utilizing Germanium integration to enhance photodetector performance within photonic circuits.
Background:
With the growing demand for faster and more efficient optical communication systems, integrating photonic components directly...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake, Thomas Adam
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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Fabricating Photonics Structure Conductive Pathways
This technology improves the photodetector functionality in photonic integrated circuits by significantly reducing extended defects typically associated with buffer layers.
Background:
Photonics is the science of manipulating light to perform electronic and other functions while making use of light’s advantages, including higher speed and...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Campus > AIM Photonics
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SiCN over Photonics Structures
This technology advances the fabrication and functionality of photonic integrated circuits by improving the deposition and manipulation of silicon carbon nitride and silicon nitride.
Background:
Photonics is the science of manipulating light to perform electronic and other functions while leveraging light’s advantages, including higher speed...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake
Keywords(s):
Category(s): Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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Integration of III-V Laser and III-V Material into Silicon Photonics Technology
This technology integrates CMOS standard manufacturing processes and Silicon (Si) substrates with direct epitaxial growth of III-V lasers, to improve manufacturing throughput, reduce costs, and produce high-performance, compact photonic integrated circuits (PICs).
Background:
Photonic integrated circuits (PICs) are chips designed to manipulate light...
Published: 3/25/2026
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Inventor(s): William Charles, Douglas Coolbaugh, Gerald Leake, Douglas La Tulipe, John Bowers
Keywords(s):
Category(s): Campus > NY CREATES, Technology Classifications > Optics and Photonics
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Integration of Through Silicon Vias (TSVs) in a standard CMOS process flow using pre-contact processing
This technology integrates TSV structures into industry standard CMOS manufacturing processes, enabling the fabrication of 3D integrated circuits.
Background:
Three dimensional (3D) integrated circuits (ICs) use high-density, short through silicon via (TSV) -based vertical interconnects. These 3D components provide new opportunities to design and...
Published: 1/29/2026
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Inventor(s): Jeremiah Hebding, Megha Rao, Colin McDonough, Mathew Smalley, Douglas Coolbaugh, Joseph Piccirillo, Stephen Bennett, Michael Liehr
Keywords(s):
Category(s): Campus > NY CREATES, Technology Classifications > Computers
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