Integration of III-V Laser and III-V Material into Silicon Photonics Technology
This technology integrates CMOS standard manufacturing processes and Silicon (Si) substrates with direct epitaxial growth of III-V lasers, to improve manufacturing throughput, reduce costs, and produce high-performance, compact photonic integrated circuits (PICs).
Background:
Photonic integrated circuits (PICs) are chips designed to manipulate light...
Published: 2/26/2026
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Inventor(s): William Charles, Douglas Coolbaugh, Gerald Leake, Douglas La Tulipe, John Bowers
Keywords(s):
Category(s): Campus > NY CREATES, Campus > SUNY Polytechnic Institute, Technology Classifications > Optics and Photonics
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