Ultra Defect free Germanium Photodiode in SOI substrates
This technology introduces an innovative method for producing ultra-thin, defect-free germanium photodiodes on silicon-on-insulator (SOI) substrates, overcoming longstanding challenges related to lattice mismatch defects.
Background:
Conventional attempts to integrate germanium photodiodes on SOI substrates have faced significant challenges due...
Published: 9/9/2026
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Inventor(s): Gerald Leake, Joshua Herman, Christopher Baiocco
Keywords(s): compound semiconductor, defect-tolerant semiconductor, design, detection, electronics, photonics, semiconductor processing, substrate technology, Technologies
Category(s): Campus > AIM Photonics, Technology Classifications > Optics and Photonics
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Aluminum Nitride, Alumina (Saphire) and thick Silicon Nitride Integration into SUNYRFs quantum Platform
This technology integrates aluminum nitride, alumina (sapphire), and thick silicon nitride into a quantum photonics platform, enabling advanced device performance across visible to infrared wavelengths.
Background:
Quantum photonics requires innovative materials and device architectures to improve functionality, especially for non-linear photonics...
Published: 9/9/2026
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Inventor(s): Gerald Leake, Lewis Carpenter, Tuan Vo, Matthew Smalley, David Harame, Dan Coleman
Keywords(s): photonics, Technologies
Category(s): Campus > AIM Photonics, Technology Classifications > Optics and Photonics
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Method for fabricating thick silicon nitride waveguides
This technology presents a novel method for fabricating thick silicon nitride waveguides through multi-layer deposition and thermal processing, enabling improved optical performance for advanced photonic applications.
Background:
Traditional fabrication of thick silicon nitride (SiN) waveguides faces challenges such as high stress in deposited films...
Published: 9/9/2026
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Inventor(s): Nicholas Fahrenkopf, Gerald Leake, Lewis Carpenter, Katrina Morgan
Keywords(s): Technologies
Category(s): Campus > AIM Photonics, Technology Classifications > Optics and Photonics
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Wafer Scale Bonded Active Photonics Interposer
This technology enables the creation of advanced photonic interposers by bonding photonics devices onto a wafer-scale base, improving integration and connectivity for optical and electronic components in microchips.
Background:
The field of integrated photonics has become increasingly important as demand for faster data transmission and higher bandwidth...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Douglas La Tulipe, Gerald Leake
Keywords(s):
Category(s): Technology Classifications > Nanotechnology, Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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Integrated Photonics Process on SOI Wafers
This technology presents an advanced method for fabricating integrated photonic structures on silicon-on-insulator wafers, utilizing Germanium integration to enhance photodetector performance within photonic circuits.
Background:
With the growing demand for faster and more efficient optical communication systems, integrating photonic components directly...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake, Thomas Adam
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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Fabricating Photonics Structure Conductive Pathways
This technology improves the photodetector functionality in photonic integrated circuits by significantly reducing extended defects typically associated with buffer layers.
Background:
Photonics is the science of manipulating light to perform electronic and other functions while making use of light’s advantages, including higher speed and...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Campus > AIM Photonics
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SiCN over Photonics Structures
This technology advances the fabrication and functionality of photonic integrated circuits by improving the deposition and manipulation of silicon carbon nitride and silicon nitride.
Background:
Photonics is the science of manipulating light to perform electronic and other functions while leveraging light’s advantages, including higher speed...
Published: 9/9/2026
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Inventor(s): Douglas Coolbaugh, Gerald Leake
Keywords(s):
Category(s): Technology Classifications > Optics and Photonics, Campus > AIM Photonics
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Integration of III-V Laser and III-V Material into Silicon Photonics Technology
This technology integrates CMOS standard manufacturing processes and Silicon (Si) substrates with direct epitaxial growth of III-V lasers, to improve manufacturing throughput, reduce costs, and produce high-performance, compact photonic integrated circuits (PICs).
Background:
Photonic integrated circuits (PICs) are chips designed to manipulate light...
Published: 3/25/2026
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Inventor(s): William Charles, Douglas Coolbaugh, Gerald Leake, Douglas La Tulipe, John Bowers
Keywords(s):
Category(s): Campus > NY CREATES, Technology Classifications > Optics and Photonics
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