Search Results

1 Results
for "ling+wang"
Use Advanced Search
Sort By:

Creep Resistant Cu-based CuCrNbZr Alloy with High Thermal Conductivity

A novel Cu-based alloy with high thermal conductivity and thermal creep resistance for high-temperature applicationsRSS.HDBackground> Background: <High strength, high conductivity copper (Cu) alloys are a potentially attractive option for a variety of demanding high heat flux structural applications ranging from aerospace to fusion energy. Fusion...
Published: 4/26/2024   |   Inventor(s): Lance Snead, Lizhen Tan, Ling Wang, Steven Zinkle
Category(s): Technology Classifications, Technology Classifications > Material and Composites, Campus > Stony Brook University

Search SUNY Technologies

Trending Searches

Latest Technologies