Gas-phase Polymerization for Adhesive Bonding and Packaging Applications
Provides solvent-free bonding of substrates for manufacturing electronic components. Background: Wafer bonding is a microelectromechanical (MEMS), nanoelectromechanical (NEMS), microelectronic, and/or optoelectronic packaging technology for mechanically stable and hermetically sealed device encapsulation. A number of wafer bonding methods have been...
Published: 12/26/2023
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Inventor(s): Magnus Bergkvist
Keywords(s):
Category(s): Technology Classifications > Materials and Chemicals, Campus > SUNY Polytechnic Institute
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