Reconfigurable RF/Digital Hybrid 3D Interconnect
A novel interconnect technology that enables system designers to take better advantage of increased IC power while satisfying energy consumption and space limitations.
Background:
As the semiconductor industry develops technologies on the nano-scale, interconnect latency is increasing. This places serious limitations on designs, as the input/output...
Published: 2/23/2024
|
Inventor(s): Robert Geer, Wei Wang, Tong Jing
Keywords(s): Technologies
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Biomedical Science and Engineering, Technology Classifications > Imaging, Technology Classifications > Medical Imaging, Technology Classifications > Optics and Photonics, Technology Classifications > Research Tools and Reagents
|