Aerosol Jetting Nanostructured Copper Towards High Temperature
Combines additive manufacturing ease of jet printing with the conductive efficiency of copper and graphene to print high temperature resistant circuits.
Background:
Copper is the electrical conductor metal of choice based on price, availability and efficiency. However, copper has limitations for printing high density circuits and heat resistance....
Published: 2/2/2024
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Inventor(s): Shenqiang Ren, Aaron Sheng, Saurabh Khuje
Keywords(s): Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology, Technology Classifications > Electronics
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Ultrahigh Temperature, Flexible, Printed Copper Electronics
Superior thermal and electronic stability of printed copper-flexible ceramic electronics by means of integral hybridization and passivation strategies.
Background:
Advanced high-temperature materials, metals, and ceramics, have been widely sought after for printed flexible electronics under extreme conditions. However, the thermal stability and electronic...
Published: 2/2/2024
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Inventor(s): Shenqiang Ren, Aaron Sheng, Saurabh Khuje
Keywords(s): Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology, Technology Classifications > Electronics
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Nature-inspired Functionally-graded UHMWPE + Kevlar Composites Achieve Extraordinarily High Strength
Nature-inspired polymers are achieved using unique processing to yield functional gradient composites with embedded Kevlar fibers exhibiting extraordinarily high strength lightweight UHMWPE materials.
Background:
Demand for new energy absorption materials and implantable polymeric biomaterials has increased significantly in recent years. The...
Published: 2/2/2024
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Inventor(s): Shenqiang Ren, Lu An
Keywords(s): Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology, Technology Classifications > Engineering
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