System and Methods for Detecting, Capturing, and Measuring Nanoparticles
Speeds the semiconductor manufacturing process by detecting particles smaller than 20nm before they have adhered to the silicon wafer.
Background:
The conventional method for of detecting particles during the semiconductor manufacturing process occurs only after the particles have adhered to silicon wafer. While that approach is easier because...
Published: 12/20/2023
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Inventor(s): Gregory Denbeaux, Yashdeep Khopkar
Keywords(s): defect-tolerant semiconductor, Technologies
Category(s): Technology Classifications > Nanotechnology, Campus, Campus > SUNY Polytechnic Institute
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