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New Liquid Cooling System for High Power Electronics Package

Provides direct cooling for data centers, microelectronics packages, and chips via a fluid cooling system. Background: During operation, high-power electronics typically generate high heat. To avoid degradation and fault within the electronics, this heat must be continuously removed. Air cooling is one traditional method of dissipating this heat....
Published: 5/1/2024   |   Inventor(s): Leila Choobineh, Bahgat Sammakia
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications, Technology Classifications > Electronics, Campus > Binghamton University

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