High-Performance Liquid-Cooled Cold Plates for Targeted Hotspot Management in Multi-Chip Systems
This invention introduces advanced liquid-cooled cold plates with localized micro-channel, pin fin, and lattice structures that deliver targeted hotspot cooling, quasi-uniform temperatures, and reduced pumping power for multi-chip modules and 3D-ICs.
Background:
High-performance computing systems, AI accelerators, and data centers face thermal management...
Published: 9/9/2025
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Inventor(s): Yaser Hadad, Mahdi Farahikia, Bahgat Sammakia, Paul Chiarot
Keywords(s): Technologies
Category(s): Campus > Binghamton University
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Energy-Efficient Preheater for Advanced Data Center and Electronics Cooling
This invention introduces a regenerative preheater for phase change cooling that reuses waste heat to preheat refrigerant, reducing subcooling, improving efficiency, and eliminating the need for external heaters.
Background:
Data centers and high-performance computing systems, especially those powering AI, generate extreme heat that challenges cooling...
Published: 9/8/2025
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Inventor(s): Sadegh Khalili, Bahgat Sammakia
Keywords(s): CleanTech
Category(s): Campus > Binghamton University, Technology Classifications > Engineering
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New Liquid Cooling System for High Power Electronics Package
Provides direct cooling for data centers, microelectronics packages, and chips via a fluid cooling system. Background: During operation, high-power electronics typically generate high heat. To avoid degradation and fault within the electronics, this heat must be continuously removed. Air cooling is one traditional method of dissipating this heat....
Published: 5/13/2025
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Inventor(s): Leila Choobineh, Bahgat Sammakia
Keywords(s):
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications, Technology Classifications > Electronics, Campus > Binghamton University
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New Liquid Cooling System for High Power Electronics Package
New liquid cooling system for high-power electronics.
Technology Overview:
A new liquid cooling system which is a combination of embedded channels and cold plates has been designed. This novel cooling system consists of two sections: a top section which is connected to the package, and a bottom section which is connected to the liquid inlet...
Published: 8/21/2025
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Inventor(s): Bahgat Sammakia
Keywords(s): CleanTech
Category(s): Technology Classifications > Electronics, Campus > Binghamton University
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Nanomaterials Construction of Thermal Interface Materials
A hybrid thermal interface material that minimizes the thermal resistance between two solid surfaces, that can be used for applications requiring high thermal dissipation
Technology Overview:
This invention covers the system-level design, use and placement of a hybrid Thermal Interface Material (TIM) system comprised of a matrix of aligned Carbon...
Published: 8/21/2025
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Inventor(s): Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikyn Yank
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Nanotechnology, Campus > Binghamton University
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Ceramic Thin Film Embedded Capacitors
Method for size reduction, increased functionality, improved high frequency performance, cost savings and increased reliability of typically crowded electronic circuit boards
Background:
As electronic circuit boards become crowded with numerous discrete components, additional advances require utilization of the inner spaces of electronics packaging...
Published: 8/21/2025
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Inventor(s): Junghyun Cho, Bahgat Sammakia, Roy Magnuson, Mark Poliks
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University
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Control Systems and Prediction Methods for IT Cooling Performance in Containment
Control systems and prediction methods for it cooling performance in containment systems by effectively controlling airflow
Background:
Containment is becoming a standard modality in data centers today due to its inherent energy efficiency advantages. Cold aisle containment, hot aisle containment, chimney, enclosed racks and rear door heat exchangers...
Published: 8/21/2025
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Inventor(s): Husam Alissa, Kourosh Nemati, Bahgat Sammakia, Kanad Ghose
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Clean Energy, Campus > Binghamton University
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Nano-pastes for Thermal, Electrical, and Mechanical Bonding
Novel paste materials for thermal, electrical and mechanical bonding of two solid surfaces.
Technology Overview:
The pastes contain organic and inorganic hybrid materials and are easy to apply to substrate for assembly. The pastes can be used as thermal interface materials for high demand thermal management applications such as high power microelectronics...
Published: 8/21/2025
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Inventor(s): Hao Wang, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Materials and Chemicals, Campus > Binghamton University
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Method and Pattern of Dispensing Thermal Interface Materials
Pattern of dispensing thermal interface materials that forms thinner layers rapidly with reduced force and avoids post modification of the microprocessor chip and/or cooling device
Technology Overview:
This invention relates to thermal interfaces between microprocessor chips and cooling devices and to a method of forming thinner TIM layers more...
Published: 8/21/2025
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Inventor(s): Drew Davidson, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University
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