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New Liquid Cooling System for High Power Electronics Package

Provides direct cooling for data centers, microelectronics packages, and chips via a fluid cooling system. Background: During operation, high-power electronics typically generate high heat. To avoid degradation and fault within the electronics, this heat must be continuously removed. Air cooling is one traditional method of dissipating this heat....
Published: 5/1/2024   |   Inventor(s): Leila Choobineh, Bahgat Sammakia
Keywords(s):  
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications, Technology Classifications > Electronics, Campus > Binghamton University

New Liquid Cooling System for High Power Electronics Package

New liquid cooling system for high-power electronics. Technology Overview: A new liquid cooling system which is a combination of embedded channels and cold plates has been designed. This novel cooling system consists of two sections: a top section which is connected to the package, and a bottom section which is connected to the liquid inlet...
Published: 12/28/2023   |   Inventor(s): Bahgat Sammakia
Keywords(s): CleanTech
Category(s): Technology Classifications > Electronics, Campus > Binghamton University

Nanomaterials Construction of Thermal Interface Materials

A hybrid thermal interface material that minimizes the thermal resistance between two solid surfaces, that can be used for applications requiring high thermal dissipation Technology Overview: This invention covers the system-level design, use and placement of a hybrid Thermal Interface Material (TIM) system comprised of a matrix of aligned Carbon...
Published: 8/23/2021   |   Inventor(s): Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikyn Yank
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Nanotechnology, Campus > Binghamton University

Ceramic Thin Film Embedded Capacitors

Method for size reduction, increased functionality, improved high frequency performance, cost savings and increased reliability of typically crowded electronic circuit boards Background: As electronic circuit boards become crowded with numerous discrete components, additional advances require utilization of the inner spaces of electronics packaging...
Published: 9/30/2021   |   Inventor(s): Junghyun Cho, Bahgat Sammakia, Roy Magnuson, Mark Poliks
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University

Positive Ceramic/SAM (Self-Assembled Monolayer) Bilayer Coatings

A dipping process that deposits a bi-layer coating consisting of a ceramic film with a compliant self-assembled monolayer binding layer grow ceramic thin films onto silicon substrates Background: A dipping process that deposits a bi-layer coating consisting of a ceramic film with a compliant self-assembled monolayer (SAM) binding layer grow ceramic...
Published: 9/30/2021   |   Inventor(s): Junghyun Cho, Wayne Jones, Scott Oliver, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Engineering, Technology Classifications > Electronics, Campus > Binghamton University

Control Systems and Prediction Methods for IT Cooling Performance in Containment

Control systems and prediction methods for it cooling performance in containment systems by effectively controlling airflow Background: Containment is becoming a standard modality in data centers today due to its inherent energy efficiency advantages. Cold aisle containment, hot aisle containment, chimney, enclosed racks and rear door heat exchangers...
Published: 9/28/2023   |   Inventor(s): Husam Alissa, Kourosh Nemati, Bahgat Sammakia, Kanad Ghose
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Clean Energy, Campus > Binghamton University

Nano-pastes for Thermal, Electrical, and Mechanical Bonding

Novel paste materials for thermal, electrical and mechanical bonding of two solid surfaces. Technology Overview: The pastes contain organic and inorganic hybrid materials and are easy to apply to substrate for assembly. The pastes can be used as thermal interface materials for high demand thermal management applications such as high power microelectronics...
Published: 3/9/2021   |   Inventor(s): Hao Wang, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Materials and Chemicals, Campus > Binghamton University

Thermal Interposers with Nano Structures

This invention manages thermal challenges in increasingly high-power applications using metal nanostructures with very high thermal conductivity Technology Overview: This invention manages thermal challenges in increasingly high power applications and “hot” chip packages. For microelectronics and laser companies using high power...
Published: 8/23/2021   |   Inventor(s): Wayne Jones, Bahgat Sammakia
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University

Method and Pattern of Dispensing Thermal Interface Materials

Pattern of dispensing thermal interface materials that forms thinner layers rapidly with reduced force and avoids post modification of the microprocessor chip and/or cooling device Technology Overview: This invention relates to thermal interfaces between microprocessor chips and cooling devices and to a method of forming thinner TIM layers more...
Published: 8/23/2021   |   Inventor(s): Drew Davidson, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University

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