Direct-to-chip diamond-backed cooling for AI and HPC chiplets
This invention integrates a crystalline diamond- or sapphire-backed heat spreader directly onto silicon wafers prior to chip fabrication, paired with a sealed fluid chamber that delivers direct-to-chip liquid cooling without thermal interface materials. The result is a low-resistance, high-efficiency cooling path that improves reliability, reduces energy...
Published: 3/10/2026
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Inventor(s): Kanad Ghose, Bahgat Sammakia, Srikanth Rangarajan
Keywords(s): Technologies
Category(s): Campus > Binghamton University
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High-Performance Liquid-Cooled Cold Plates for Targeted Hotspot Management in Multi-Chip Systems
This invention introduces advanced liquid-cooled cold plates with localized micro-channel, pin fin, and lattice structures that deliver targeted hotspot cooling, quasi-uniform temperatures, and reduced pumping power for multi-chip modules and 3D-ICs.
Background:
High-performance computing systems, AI accelerators, and data centers face thermal management...
Published: 11/12/2025
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Inventor(s): Yaser Hadad, Mahdi Farahikia, Bahgat Sammakia, Paul Chiarot
Keywords(s): Technologies
Category(s): Campus > Binghamton University
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Energy-Efficient Preheater for Advanced Data Center and Electronics Cooling
This invention introduces a regenerative preheater for phase change cooling that reuses waste heat to preheat refrigerant, reducing subcooling, improving efficiency, and eliminating the need for external heaters.
Background:
Data centers and high-performance computing systems, especially those powering AI, generate extreme heat that challenges cooling...
Published: 11/12/2025
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Inventor(s): Sadegh Khalili, Bahgat Sammakia
Keywords(s): CleanTech
Category(s): Campus > Binghamton University, Technology Classifications > Engineering
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High-Performance Dual-Flow Liquid Cooling System for Advanced Electronics
This invention introduces a next-generation liquid cooling system that integrates embedded microchannels with cold plates to achieve exceptional heat removal, uniform temperature distribution, and low pressure drop for high-power electronics. Its perpendicular dual-flow design ensures continuous coolant renewal, enabling reliable thermal performance...
Published: 11/21/2025
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Inventor(s): Bahgat Sammakia
Keywords(s): CleanTech
Category(s): Technology Classifications > Electronics, Campus > Binghamton University
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Advanced Nano-Fiber Composite TIM for Ultra-High-Performance Electronics Cooling
This technology solves a major heat problem in modern electronics, where traditional thermal interface materials struggle to move heat away fast enough and carbon-nanotube options are often fragile or hard to manufacture. It uses tiny, well-aligned fibers with protective layers to move heat away quickly while maintaining flexibility, durability, and...
Published: 4/27/2026
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Inventor(s): Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikyn Yank
Keywords(s): #SUNYresearch, Technologies
Category(s): Campus, Campus > Binghamton University, Technology Classifications, Technology Classifications > Nanotechnology
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Control Systems and Prediction Methods for IT Cooling Performance in Containment
Control systems and prediction methods for it cooling performance in containment systems by effectively controlling airflow
Background:
Containment is becoming a standard modality in data centers today due to its inherent energy efficiency advantages. Cold aisle containment, hot aisle containment, chimney, enclosed racks and rear door heat exchangers...
Published: 1/21/2026
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Inventor(s): Husam Alissa, Kourosh Nemati, Bahgat Sammakia, Kanad Ghose
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Clean Energy, Campus > Binghamton University
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High Conductivity Sintering Pastes for Durable Thermal and Electrical Bonding
This invention provides hybrid pastes that transform into a highly conductive metallic network capable of carrying heat, electricity and mechanical load. By removing the organic phase during heating and sintering the inorganic particles, the paste forms a strong bond that works at very high temperatures where conventional materials fail.
Background:...
Published: 4/28/2026
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Inventor(s): Hao Wang, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Campus, Campus > Binghamton University, Technology Classifications > Nanotechnology, Technology Classifications > Materials and Chemicals
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Method and Pattern of Dispensing Thermal Interface Materials
Pattern of dispensing thermal interface materials that forms thinner layers rapidly with reduced force and avoids post modification of the microprocessor chip and/or cooling device
Technology Overview:
This invention relates to thermal interfaces between microprocessor chips and cooling devices and to a method of forming thinner TIM layers more...
Published: 11/12/2025
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Inventor(s): Drew Davidson, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University
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