High-Performance Liquid-Cooled Cold Plates for Targeted Hotspot Management in Multi-Chip Systems
This invention introduces advanced liquid-cooled cold plates with localized micro-channel, pin fin, and lattice structures that deliver targeted hotspot cooling, quasi-uniform temperatures, and reduced pumping power for multi-chip modules and 3D-ICs.
Background:
High-performance computing systems, AI accelerators, and data centers face thermal management...
Published: 9/9/2025
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Inventor(s): Yaser Hadad, Mahdi Farahikia, Bahgat Sammakia, Paul Chiarot
Keywords(s): Technologies
Category(s): Campus > Binghamton University
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