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Advanced Nano-Fiber Composite TIM for Ultra-High-Performance Electronics Cooling

This technology solves a major heat problem in modern electronics, where traditional thermal interface materials struggle to move heat away fast enough and carbon-nanotube options are often fragile or hard to manufacture. It uses tiny, well-aligned fibers with protective layers to move heat away quickly while maintaining flexibility, durability, and...
Published: 4/27/2026   |   Inventor(s): Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikyn Yank
Keywords(s): #SUNYresearch, Technologies
Category(s): Campus, Campus > Binghamton University, Technology Classifications, Technology Classifications > Nanotechnology

High Conductivity Sintering Pastes for Durable Thermal and Electrical Bonding

This invention provides hybrid pastes that transform into a highly conductive metallic network capable of carrying heat, electricity and mechanical load. By removing the organic phase during heating and sintering the inorganic particles, the paste forms a strong bond that works at very high temperatures where conventional materials fail. Background:...
Published: 4/28/2026   |   Inventor(s): Hao Wang, Bahgat Sammakia
Keywords(s): #SUNYresearch, Technologies
Category(s): Campus, Campus > Binghamton University, Technology Classifications > Nanotechnology, Technology Classifications > Materials and Chemicals

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